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High purity bisphenol A-based epoxy resin with consistent molecular weight distribution.
Excellent thermal stability and low volatility during processing.
Superior compatibility with common amine and anhydride curing agents.
Low chloride content (< 500 ppm), ensuring enhanced electrical insulation properties.
Optimized viscosity for easy handling, dispensing, and impregnation in industrial applications.
Electrical laminates and printed circuit board (PCB) prepregs.
High-voltage insulating castings and potting compounds.
Structural adhesives for aerospace and automotive composites.
Wind turbine blade matrix resins requiring dimensional stability and fatigue resistance.
Coatings for corrosion-resistant steel and aluminum substrates in marine and industrial environments.
| Chemical Type | Bisphenol A diglycidyl ether (DGEBA) |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free from gel or sediment |
| Epoxy Equivalent Weight (EEW) | 184–190 g/eq |
| Viscosity (25°C) | 12,000–16,000 mPa·s |
| Chlorine Content | ≤ 500 ppm |
| Color (Gardner) | ≤ 3 |
| Softening Point | Not applicable (liquid at room temperature) |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
