English
Español
tiếng việt
русский
High-purity bisphenol-A based liquid epoxy resin with consistent molecular weight distribution.
Low viscosity (12,000–14,000 cP at 25°C) enabling excellent processability and wetting in composite formulations.
Superior thermal stability with glass transition temperature (Tg) of cured resin exceeding 120°C.
Excellent electrical insulation properties and low dielectric loss suitable for electronic encapsulation.
Reactive epoxide equivalent weight (EEW) of 184–190 g/eq, ensuring precise stoichiometric control during curing.
Electrical insulation coatings for transformers and reactors.
Encapsulation and potting compounds for power electronics and LED modules.
Structural adhesives in aerospace and automotive composites.
Matrix resin for filament-wound pressure vessels and FRP tanks.
High-performance laminates in printed circuit board (PCB) prepregs.
| Chemical Type | Bisphenol-A diglycidyl ether (DGEBA) |
| Product Form | Clear, pale yellow liquid |
| Appearance | Homogeneous, transparent, free of gel particles or sediment |
| Epoxide Equivalent Weight (EEW) | 184–190 g/eq |
| Viscosity (25°C) | 12,000–14,000 cP |
| Chlorine Content (Total Cl) | ≤ 700 ppm |
| Volatiles Content | ≤ 0.3 wt% |
| Storage Stability (25°C) | ≥ 12 months in sealed containers |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
