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High-purity bisphenol-A based liquid epoxy resin with low ionic impurities.
Excellent compatibility with standard amine and anhydride curing agents.
Low viscosity (10,000–12,000 cP at 25°C) for enhanced processability and filler wetting.
Superior adhesion to metals, composites, and cured polymer substrates.
Good thermal stability and chemical resistance after full cure.
Structural adhesives for aerospace and automotive bonding.
Electrical encapsulation and potting compounds for power electronics.
High-performance composite matrices in wind turbine blades and sporting goods.
Coating resins for corrosion-resistant industrial linings and tank coatings.
Formulation base for advanced prepregs and filament-wound components.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Liquid |
| Appearance | Pale yellow, transparent liquid |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 10,000–12,000 cP |
| Epoxide Content | 17.5–18.5 % by weight |
| Chloride Content | ≤ 500 ppm |
| Softening Point | 12–16°C |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
