Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Sanmu SM604F Bisphenol A Epoxy Resin

Sanmu SM604F is a high-purity bisphenol A epoxy resin from the Sanmu SM series, offering excellent adhesion, chemical resistance and thermal stability. Widely used in composites, electrical encapsulation and advanced coatings, it features low viscosity, superior mechanical strength and consistent reactivity for reliable curing performance in demanding industrial applications.
  • sanmu sm604f bisphenol a epoxy resin_ccb9ee28
  • sanmu sm604f bisphenol a epoxy resin_ccb9ee28

Features Of Sanmu SM604F Bisphenol A Epoxy Resin

  1. High purity bisphenol A-based epoxy resin with consistent molecular weight distribution.

  2. Excellent thermal stability and low ionic impurity content for enhanced electrical insulation performance.

  3. Optimized viscosity for improved processability in solvent-based and solvent-free coating systems.

  4. Superior adhesion to metals, composites, and cured epoxy substrates.

  5. Compatible with standard amine, anhydride, and phenolic curing agents.

Typical Applications Of Sanmu SM604F Bisphenol A Epoxy Resin

  1. Electrical encapsulation and potting compounds for transformers and power electronics.

  2. High-performance protective coatings for offshore and industrial steel structures.

  3. Composite matrix resin for wind turbine blades and aerospace secondary structural parts.

  4. Adhesives and laminating resins for printed circuit board (PCB) prepregs and copper-clad laminates.

  5. Tooling and casting resins requiring dimensional stability and low shrinkage.

Specifications Of Sanmu SM604F Bisphenol A Epoxy Resin

Chemical TypeBisphenol A diglycidyl ether (DGEBA) epoxy resin
Product FormClear to pale yellow viscous liquid
AppearanceHomogeneous, transparent, free of visible particles or gel
Epoxy Equivalent Weight (EEW)185–192 g/eq
Viscosity (25°C)11,000–14,000 mPa·s
Chloride Content≤ 800 ppm
Volatiles Content≤ 0.3 wt%
Softening Point10–14°C


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