High purity bisphenol A-based epoxy resin with consistent molecular weight distribution.
Excellent thermal stability and low ionic impurity content for enhanced electrical insulation performance.
Optimized viscosity for improved processability in solvent-based and solvent-free coating systems.
Superior adhesion to metals, composites, and cured epoxy substrates.
Compatible with standard amine, anhydride, and phenolic curing agents.
Electrical encapsulation and potting compounds for transformers and power electronics.
High-performance protective coatings for offshore and industrial steel structures.
Composite matrix resin for wind turbine blades and aerospace secondary structural parts.
Adhesives and laminating resins for printed circuit board (PCB) prepregs and copper-clad laminates.
Tooling and casting resins requiring dimensional stability and low shrinkage.
| Chemical Type | Bisphenol A diglycidyl ether (DGEBA) epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free of visible particles or gel |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 11,000–14,000 mPa·s |
| Chloride Content | ≤ 800 ppm |
| Volatiles Content | ≤ 0.3 wt% |
| Softening Point | 10–14°C |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China