High reactivity with standard amine and anhydride curing agents for rapid gelation and reduced cycle times.
Excellent adhesion to metals, composites, and treated plastics without requiring primers.
Low viscosity (8,000–12,000 cP at 25°C) enabling easy processing via casting, impregnation, and filament winding.
Superior thermal stability with glass transition temperature (Tg) up to 125°C after post-cure.
Good chemical resistance to dilute acids, alkalis, and aliphatic hydrocarbons in cured form.
Electrical encapsulation and potting of transformers, sensors, and power modules.
Structural adhesive formulations for aerospace composite bonding and automotive lightweight assemblies.
Matrix resin for carbon fiber and fiberglass reinforced laminates in wind turbine blades and marine components.
Coating systems for corrosion protection of steel substrates in industrial and marine environments.
3D printing resins for high-resolution stereolithography (SLA) parts requiring dimensional stability and mechanical robustness.
| Chemical Type | Bisphenol-A based liquid epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free of gels or sediment |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity (25°C) | 8,000–12,000 cP |
| Chloride Content | ≤ 500 ppm |
| Volatiles Content | ≤ 0.5 wt% |
| Storage Stability | 12 months at ≤ 25°C in sealed original container |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China