High purity bisphenol-A based liquid epoxy resin with consistent molecular weight distribution.
Excellent thermal stability and low volatility for safe handling during high-temperature processing.
Low chlorine content (< 800 ppm), ensuring superior electrical insulation properties.
Optimized viscosity (12,000–14,000 cP at 25°C) for enhanced processability in casting and impregnation.
Compatible with standard amine and anhydride curing agents for broad formulation flexibility.
Electrical encapsulation of transformers, reactors, and high-voltage insulators.
Structural adhesives for aerospace composite bonding and automotive under-hood components.
High-performance laminating resin for printed circuit board (PCB) prepregs and copper-clad laminates.
Casting compounds for LED housings, sensors, and precision electronic modules.
Wind turbine blade root joints and structural reinforcements requiring fatigue resistance.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Clear, pale yellow liquid |
| Appearance | Homogeneous, transparent, free from gel or sediment |
| Epoxy Equivalent Weight (EEW) | 183–189 g/eq |
| Viscosity (25°C) | 12,000–14,000 cP |
| Chlorine Content | ≤ 800 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Primary Applications | Electrical insulation, structural composites, high-reliability encapsulation |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China