English
Español
tiếng việt
русский
High reactivity with amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and cured epoxy substrates without primer.
Low viscosity (12,000–15,000 cP at 25°C) enabling easy processing, impregnation, and flow control.
Superior chemical resistance to alkalis, solvents, and mild acids after full cure.
Low chloride content (< 800 ppm), minimizing corrosion risk in electronic and aerospace applications.
Structural adhesives for automotive bonding and lightweight composite assembly.
Matrix resin for filament-wound pressure vessels and CFRP wind blade components.
Encapsulants and potting compounds for high-reliability power electronics.
Tooling resins for low-CTE, dimensionally stable molds and master models.
Electrical laminates requiring high dielectric strength and tracking resistance.
| Chemical Type | Bisphenol-F based liquid epoxy resin |
| Product Form | Clear, amber-colored low-viscosity liquid |
| Appearance | Transparent, slightly viscous liquid at 25°C |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity (25°C) | 12,000–15,000 cP |
| Chloride Content | < 800 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | 12 months at ≤25°C in sealed containers |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
