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Low-viscosity liquid epoxy resin enabling excellent flow, leveling, and substrate wetting.
High reactivity with amine and anhydride hardeners for rapid cure development at ambient or elevated temperatures.
Superior chemical resistance, particularly to alkalis, solvents, and mild acids after full cure.
Excellent adhesion to metals, concrete, and composite substrates without mandatory surface priming.
Low chlorine content ensuring enhanced electrical insulation properties and reduced corrosion risk in electronic applications.
Electrical encapsulation and potting compounds for transformers, sensors, and power modules.
High-performance industrial maintenance coatings for steel structures and offshore platforms.
Structural adhesives in automotive and aerospace bonding assemblies requiring thermal stability.
Reinforced polymer composites for wind turbine blades and pultruded profiles.
| Chemical Type | Diglycidyl ether of bisphenol-A (DGEBA) |
| Product Form | Clear to pale yellow low-viscosity liquid |
| Appearance | Transparent, slightly viscous liquid |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity at 25°C | 10,000–14,000 mPa·s |
| Chloride Content | ≤ 500 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Primary Applications | Encapsulants, high-performance coatings, structural adhesives, composites |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
