High reactivity with amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and treated plastics without primer requirement.
Low viscosity (8,000–12,000 cP at 25°C) enabling easy processing via casting, impregnation, and filament winding.
Superior thermal stability with glass transition temperature (Tg) up to 125°C after full cure.
Low chloride content (< 500 ppm), ensuring high electrical insulation performance and corrosion resistance.
Electrical encapsulation of transformers, reactors, and medium-voltage switchgear components.
Structural adhesive formulation for aerospace composite bonding and automotive lightweight assemblies.
Matrix resin for fiber-reinforced laminates in wind turbine blade root joints and marine structural parts.
High-performance potting compound for industrial sensors, LED modules, and power electronics.
Prepreg and infusion resin system for carbon fiber and glass fiber reinforced thermoset composites.
| Chemical Type | Bisphenol-F based liquid epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free from gels or sediment |
| Epoxy Equivalent Weight (EEW) | 180–195 g/eq |
| Viscosity (25°C) | 8,000–12,000 cP |
| Chloride Content | < 500 ppm |
| Volatiles (by weight) | < 0.3% |
| Storage Stability | 12 months at ≤25°C in sealed containers |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China