Highly reactive bisphenol-A based liquid epoxy resin with excellent flow and wetting properties.
Low viscosity enables easy processing, solvent-free formulation, and superior compatibility with common curing agents.
Delivers outstanding mechanical strength, chemical resistance, and thermal stability in cured networks.
Consistent batch-to-batch quality with tightly controlled epoxide equivalent weight (EEW) and low chloride content.
Optimized for ambient and elevated temperature curing systems used in industrial composites and coatings.
Structural adhesives for automotive and aerospace bonding applications.
Electrical encapsulation and potting compounds for transformers, sensors, and PCB protection.
High-performance composite matrices in wind turbine blades and carbon fiber laminates.
Corrosion-resistant lining and coating systems for steel and concrete infrastructure.
UV-curable and hybrid epoxy-acrylate formulations for advanced 3D printing resins.
| Chemical Type | Bisphenol-A diglycidyl ether (DGEBA) |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Pale yellow to water-white, transparent |
| Epoxide Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity at 25°C | 12,000–14,000 cP |
| Chlorine Content (Total Cl) | ≤ 700 ppm |
| Color (Gardner Scale) | ≤ 2 |
| Density at 25°C | 1.16–1.18 g/cm³ |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China