High-purity bisphenol-A based liquid epoxy resin with low chlorine content.
Excellent compatibility with standard amine and anhydride curing agents.
Low viscosity for improved processability in casting, laminating, and impregnation.
Superior electrical insulation properties and thermal stability after curing.
Consistent batch-to-batch quality meeting ISO 9001 manufacturing standards.
Electrical insulation systems for transformers and reactors.
High-voltage composite insulators and bushings.
Prepregs and laminates for printed circuit board (PCB) substrates.
Structural adhesives requiring thermal and chemical resistance.
Encapsulation and potting compounds for power electronics modules.
| Chemical Type | Bisphenol-A diglycidyl ether (DGEBA) |
| Product Form | Clear, pale yellow liquid |
| Appearance | Transparent, slightly viscous liquid at 25°C |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 12,000–15,000 cP |
| Chloride Content | ≤ 700 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | 12 months at ≤ 25°C in sealed containers |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China