High-purity bisphenol-A based liquid epoxy resin with consistent molecular weight distribution.
Excellent compatibility with common amine and anhydride curing agents for broad formulation flexibility.
Low viscosity (11,000–13,000 cP at 25°C) enabling easy handling, mixing, and impregnation in composite processes.
Superior electrical insulation properties and high dielectric strength for electronic encapsulation applications.
Good thermal stability and low chloride content (< 500 ppm), supporting reliability in demanding environments.
Electrical and electronic encapsulants for transformers, sensors, and power modules.
High-performance laminating resins for printed circuit board (PCB) prepregs and copper-clad laminates.
Structural adhesives requiring thermal resistance and dimensional stability.
Composite matrix resin for aerospace and automotive carbon fiber components.
Coating systems for corrosion-resistant industrial linings and tank interiors.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Liquid |
| Appearance | Clear, pale yellow to amber viscous liquid |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity (25°C) | 11,000–13,000 cP |
| Chloride Content | ≤ 500 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | Stable for ≥12 months at < 25°C in sealed containers |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China