Bifunctional silane coupling agent combining epoxy and methoxysilyl reactive groups for covalent bonding to both organic polymers and inorganic substrates.
Enhances interfacial adhesion and moisture resistance in epoxy-based composites, coatings, and encapsulants.
Offers improved hydrolytic stability compared to trialkoxysilanes due to the presence of a methyl group on the silicon center.
Enables efficient surface modification of fillers (e.g., silica, alumina, glass fibers) prior to incorporation into thermosetting resins.
Compatible with conventional epoxy curing agents and processing conditions without significant premature gelation.
Adhesion promoter in epoxy molding compounds for semiconductor packaging.
Surface modifier for mineral fillers in high-performance electrical insulating composites.
Functional additive in UV- and thermally curable epoxy-acrylate hybrid coatings.
Interfacial coupling agent in fiber-reinforced polymer (FRP) laminates and prepregs.
Moisture-scavenging component in low-dielectric encapsulation resins for microelectronics.
| Chemical Type | Epoxy-functional alkoxysilane |
| Product Form | Liquid |
| Appearance | Colorless to pale yellow clear liquid |
| Molecular Weight | 248.37 g/mol |
| Specific Gravity (25°C) | 1.02–1.04 g/cm³ |
| Refractive Index (25°C) | 1.420–1.430 |
| Flash Point (Tag Closed Cup) | ≥105°C |
| Solubility | Miscible with common organic solvents (e.g., acetone, ethanol, toluene); hydrolyzes in water |
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