High-performance two-component epoxy adhesive system offering excellent thermal and chemical resistance.
Superior adhesion to challenging substrates including composites, metals, and thermoset plastics.
Low viscosity formulation enables precise dispensing and optimal gap-filling capability.
Extended working time (pot life) at ambient temperature supports complex assembly processes.
Cured bond maintains structural integrity across a wide service temperature range (–55 °C to +180 °C).
Aerospace component bonding, including interior panels and secondary structural assemblies.
Electronics encapsulation and potting of high-reliability avionics modules.
Automotive powertrain and EV battery module assembly requiring vibration resistance.
Industrial machinery bonding where exposure to oils, solvents, and elevated temperatures occurs.
Wind turbine blade root and shear web bonding in composite manufacturing.
| Chemical Type | Bisphenol-F based epoxy resin system with amine hardener |
| Product Form | Two-component liquid (Part A: resin, Part B: hardener) |
| Appearance (Uncured) | Part A: pale amber transparent liquid; Part B: light yellow transparent liquid |
| Mix Ratio (by weight) | 100 : 35 (A:B) |
| Density (25 °C) | ~1.15 g/cm³ (mixed) |
| Viscosity (25 °C, mixed) | ~8,500 mPa·s |
| Pot Life (25 °C, 100g batch) | ~90 minutes |
| Cure Schedule (typical) | 24 hours at 25 °C, or 4 hours at 80 °C |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China