Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Solvay DAPCO 18-4F Adhesive

Solvay DAPCO 18-4F is a high-performance, fast-curing polyurethane adhesive from Solvay’s DAPCO elastomer series. Designed for demanding industrial bonding—especially in aerospace and electronics—it offers excellent thermal stability, low outgassing, and superior adhesion to composites, metals, and plastics. Its flexible formulation ensures reliable stress absorption and long-term durability under harsh conditions.
  • solvay dapco 18 4f adhesive_450cdc9d
  • solvay dapco 18 4f adhesive_450cdc9d

Features Of Solvay DAPCO 18-4F Adhesive

  1. Two-component, room-temperature curing polyurethane adhesive system with low viscosity and excellent flow characteristics.

  2. Outstanding adhesion to diverse substrates including metals, plastics, composites, and coated surfaces without priming.

  3. High toughness and impact resistance combined with good flexibility after cure.

  4. Low exotherm during cure, minimizing thermal stress on heat-sensitive components.

  5. RoHS compliant and formulated without added bisphenol A (BPA) or halogenated flame retardants.

Typical Applications Of Solvay DAPCO 18-4F Adhesive

  1. Structural bonding of electronic enclosures and housings in industrial control systems.

  2. Attachment of sensors, displays, and user-interface modules in medical devices.

  3. Assembly of lighting assemblies, including LED modules and optical lenses.

  4. Bonding of composite panels and thermoplastic parts in transportation interiors.

  5. Seam sealing and gasketing in precision instrumentation requiring dimensional stability.

Specifications Of Solvay DAPCO 18-4F Adhesive

Chemical TypeTwo-part aliphatic polyurethane
Product FormPart A: Low-viscosity liquid; Part B: Liquid hardener
Appearance (Mixed)Clear to pale yellow viscous liquid
Mix Ratio (by weight)100 : 10 (A : B)
Cure Schedule (Typical)24 hours at 23°C for handling strength; full properties in 7 days
Shore A Hardness (7 days, 23°C)75–80
Primary ApplicationsStructural bonding, potting, encapsulation, and sealing
Key FeaturesLow exotherm, no primer required, excellent substrate wetting


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