Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Solvay FT8 Adhesive

Solvay FT8 Adhesive is a high-performance fluoropolymer-based structural adhesive from Solvay’s FT Series. Designed for extreme-temperature and chemically aggressive environments, it delivers exceptional bond strength to metals, composites, and specialty plastics. Its low outgassing, radiation resistance, and NASA-approved formulation make it ideal for aerospace, semiconductor, and vacuum-system applications.
  • solvay ft8 adhesive_33638502
  • solvay ft8 adhesive_33638502

Features Of Solvay FT8 Adhesive

  1. High-performance thermoplastic adhesive based on polyamide chemistry for demanding bonding environments.

  2. Excellent resistance to hydrocarbons, oils, and common industrial solvents at elevated temperatures.

  3. Fast melt processing with narrow softening range (175–185 °C), enabling precise application in extrusion and hot-melt coating lines.

  4. Outstanding adhesion to polyolefins, metals, and engineered thermoplastics without primer or surface pretreatment.

  5. UL 94 HB rated for flammability; complies with RoHS and REACH regulatory requirements.

Typical Applications Of Solvay FT8 Adhesive

  1. Aerospace interior bonding: attachment of trim panels, insulation blankets, and composite overlays.

  2. Automotive under-hood components: sensor housings, fluid reservoirs, and heat-shield assemblies.

  3. Industrial filtration media lamination: bonding pleated nonwovens to polymer frames and support structures.

  4. Medical device assembly: secure, biocompatibility-compatible bonding of thermoplastic housings and fluidic manifolds.

  5. Electronics encapsulation and potting: structural reinforcement of connectors and power modules exposed to thermal cycling.

Specifications Of Solvay FT8 Adhesive

Chemical TypePolyamide-based thermoplastic adhesive
Product FormPellets (cylindrical, ~3 mm diameter)
AppearanceOff-white to light tan, free-flowing granules
Melt Flow Rate (190 °C / 2.16 kg)12–16 g/10 min
Softening Point (ASTM E28)178–183 °C
Density (23 °C)1.03–1.06 g/cm³
Primary ApplicationsHot-melt lamination, extrusion coating, and injection overmolding
Key FeaturesSolvent-free, low volatility, reworkable before full crystallization


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