Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Solvay Igepal CO 850 Nonylphenol Ethoxylate Nonionic Surfactant

Solvay Igepal CO-850 is a nonionic surfactant belonging to the Nonylphenol Ethoxylate (NPE) series, widely used for emulsification, wetting, and detergency in industrial cleaners, agrochemicals, and textile processing due to its excellent water solubility and low foaming profile.
  • solvay igepal co 850 nonylphenol ethoxylate nonionic surfactant_933c4d60
  • solvay igepal co 850 nonylphenol ethoxylate nonionic surfactant_933c4d60

Features Of Solvay Igepal CO 850 Nonylphenol Ethoxylate Nonionic Surfactant

  1. Highly effective wetting and emulsifying agent for aqueous systems.

  2. Excellent low-foaming performance suitable for high-shear industrial processes.

  3. Good thermal and hydrolytic stability across a broad pH range (pH 4–12).

  4. Compatible with anionic, cationic, and other nonionic surfactants in formulated systems.

  5. Provides strong solubilization capacity for hydrophobic actives and oils.

Typical Applications Of Solvay Igepal CO 850 Nonylphenol Ethoxylate Nonionic Surfactant

  1. Agrochemical adjuvant for pesticide and herbicide formulations.

  2. Emulsifier in polymer emulsion production (e.g., styrene-butadiene, acrylic latices).

  3. Wetting agent in industrial cleaning concentrates for metal and hard surface cleaners.

  4. Dispersant and stabilizer in pigment and dye dispersion systems.

  5. Component in textile auxiliaries such as scouring and dye leveling agents.

Specifications Of Solvay Igepal CO 850 Nonylphenol Ethoxylate Nonionic Surfactant

Chemical TypeNonylphenol ethoxylate (NP-9)
Product FormLiquid
AppearancePale yellow to amber viscous liquid
HLB Value~12.5
pH (1% aqueous solution)6.0–7.5
Solubility in WaterFreely soluble at room temperature
Cloud Point (1% solution)~65–70 °C
Active Matter Content~100% (typical)


Get in Touch with ERICW
Let competitive chemical materials go global.

Your Name *

Your Email *

Your Phone

Country

Your Message *