High-performance, two-component epoxy adhesive system with excellent thermal stability.
Low viscosity for superior gap-filling and wetting of complex composite substrates.
Halogen-free formulation compliant with RoHS and REACH regulatory requirements.
Fast room-temperature cure profile with optional heat acceleration for high-throughput manufacturing.
Outstanding adhesion to carbon fiber, aluminum, stainless steel, and thermoset composites.
Aerospace structural bonding of primary and secondary components.
Automotive lightweight assembly, including battery module encapsulation and EV powertrain bonding.
Wind turbine blade root and spar cap bonding in composite rotor systems.
Industrial equipment joining where resistance to thermal cycling and mechanical vibration is critical.
Electronics packaging requiring low ionic contamination and high dielectric integrity.
| Chemical Type | Epoxy resin system (two-component) |
| Product Form | Liquid resin + liquid hardener (1:1 mix ratio by volume) |
| Appearance | Amber transparent liquids (Part A), pale yellow liquid (Part B) |
| Primary Applications | Structural bonding of advanced composites and metals |
| Key Features | Halogen-free, low outgassing, high Tg (>120 °C after post-cure) |
| Benefits | Reduced processing time, improved joint durability under thermal stress |
| Cure Schedule (Standard) | 24 h at 23 °C or 2 h at 80 °C |
| Storage Conditions | 25 °C in unopened containers; protect from moisture and direct sunlight |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China