Halogen-free formulation ensures low smoke density and reduced toxic gas emission during combustion.
Excellent thermal stability, maintaining flame-retardant performance up to 300 °C in polymer processing.
High compatibility with engineering thermoplastics including polyamide (PA6, PA66) and polybutylene terephthalate (PBT).
Non-migrating design prevents blooming and surface efflorescence, ensuring long-term reliability in finished parts.
UL 94 V-0 rated at 1.6 mm thickness when compounded at recommended loading levels (15–20 wt%).
Electrical and electronic housings for connectors, switches, and circuit breakers.
Automotive under-hood components requiring UL-certified flame resistance and dimensional stability.
Consumer appliance casings, including power tools, kitchen appliances, and charging stations.
Industrial control panels and sensor enclosures exposed to elevated ambient temperatures.
3D printing filaments (PA-based) where flame retardancy and printability must be balanced.
| Chemical Type | Organophosphorus-based flame retardant (phosphinate derivative) |
| Product Form | Free-flowing white granules |
| Appearance | Off-white to light beige granules, uniform particle size distribution |
| Primary Applications | Flame-retardant compounding for polyamides (PA6, PA66), PBT, and polyphenylene ether (PPE) blends |
| Key Features | Halogen-free, RoHS-compliant, REACH-conformant, non-corrosive to processing equipment |
| Recommended Loading Range | 15–22 wt% depending on base polymer and required UL rating |
| Density (23 °C) | 1.35–1.42 g/cm³ |
| Moisture Content (max) | 0.15 wt% (as received) |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China