One-component, moisture-curing silyl-modified polymer (SMP) adhesive with no isocyanates or solvents.
Excellent adhesion to diverse substrates including metals, plastics, glass, and painted surfaces without priming.
High elasticity and permanent flexibility after curing, maintaining performance across wide temperature ranges.
Low modulus formulation enables stress relief in dynamic joints and accommodates thermal expansion/contraction.
Good UV and weather resistance, supporting long-term durability in outdoor applications.
Structural bonding of façade elements and curtain wall components in architectural glazing.
Assembly of transportation interiors, including bus, train, and recreational vehicle trim and panels.
Sealing and bonding of insulated metal panels (IMPs) and composite sandwich panels in building envelopes.
Fixation of solar mounting systems and photovoltaic module frames on rooftops and ground mounts.
Industrial bonding of HVAC enclosures, signage housings, and modular equipment casings.
| Chemical Type | Silyl-modified polymer (SMP), isocyanate-free |
| Product Form | Paste-like, thixotropic paste in cartridge |
| Appearance | Off-white to light gray, homogeneous paste |
| Primary Applications | Structural bonding, sealing, and assembly in construction and transportation |
| Key Features | Moisture-curing, primerless adhesion, high elasticity, low modulus |
| Benefits | No VOC emissions, easy application, excellent aging resistance, paintable after curing |
| Curing Mechanism | Atmospheric moisture |
| Storage Stability | 12 months unopened at ≤25 °C in dry conditions |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China