High reactivity with standard amine and anhydride hardeners, enabling rapid cure at ambient or elevated temperatures.
Excellent adhesion to metals, composites, and cured polymer substrates without mandatory surface priming.
Low viscosity (12,000–15,000 cP at 25°C) for superior flow, wetting, and impregnation in fiber-reinforced systems.
Good thermal stability with glass transition temperature (Tg) of 125–135°C in fully cured formulations.
Low chloride content (<500 ppm), minimizing corrosion risk in electronic encapsulation and metal-bonding applications.
Structural adhesives for aerospace and automotive bonding of aluminum, steel, and carbon fiber laminates.
Electrical encapsulants and potting compounds for high-voltage transformers and power electronics.
Matrix resin in pultrusion and filament winding processes for FRP profiles and utility poles.
Coating binders for corrosion-resistant industrial tank linings and offshore platform protection.
Composite tooling resins for low-expansion, high-dimensionally stable molds used in RTM and vacuum infusion.
| Chemical Type | Bisphenol-F based liquid epoxy resin |
| Product Form | Clear to pale amber viscous liquid |
| Appearance | Homogeneous, free from gels or particulates |
| Epoxy Equivalent Weight (EEW) | 178–186 g/eq |
| Viscosity (25°C) | 12,000–15,000 cP |
| Chloride Content | <500 ppm |
| Volatile Organic Compounds (VOC) | <50 g/L |
| Storage Stability | 12 months at <25°C in unopened original container |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China