High thermal stability with glass transition temperatures (Tg) up to 180 °C after post-curing.
Excellent chemical resistance to acids, alkalis, and solvents in cured form.
Low viscosity and superior flow characteristics for enhanced impregnation and void-free processing.
Outstanding adhesion to metals, composites, and engineered plastics without primer requirement.
Low ionic impurity content, ensuring high electrical insulation performance and reliability in microelectronics.
Underfill and glob-top encapsulants for flip-chip and CSP semiconductor packaging.
Matrix resin for high-performance carbon fiber reinforced polymer (CFRP) aerospace components.
Electrical potting and encapsulation of power electronics, transformers, and EV battery modules.
Structural adhesives in automotive lightweighting applications, including aluminum and mixed-material bonding.
UV/thermal dual-cure coatings for precision optical and medical device assemblies.
| Chemical Type | Diglycidyl ether of bisphenol-A (DGEBA) and advanced cycloaliphatic epoxy blends |
| Product Form | Liquid, one-component or two-component systems (depending on grade) |
| Appearance | Clear to pale yellow transparent liquid |
| Primary Applications | Electronic encapsulation, structural composites, high-reliability adhesives |
| Key Features | Low halogen content, high Tg, low shrinkage, excellent dielectric strength |
| Benefits | Reduced moisture absorption, improved long-term aging resistance, RoHS and REACH compliant |
| Storage Conditions | Store at 5–25 °C in sealed containers; protect from moisture and direct sunlight |
| Shelf Life | 12 months from date of manufacture when stored as recommended |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China