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High purity bisphenol A-based epoxy resin with consistent molecular weight distribution.
Excellent thermal stability and low ionic impurity content for enhanced electrical insulation performance.
Optimized viscosity for improved processability in solvent-free and high-solids coating systems.
Superior adhesion to metals, composites, and cured polymer substrates.
Low chloride ion content (< 500 ppm), supporting reliability in electronic encapsulation applications.
Electrical and electronic encapsulants for ICs, sensors, and power modules.
High-performance protective coatings for industrial steel structures and marine equipment.
Matrix resin for carbon fiber and glass fiber reinforced composites in aerospace and wind energy.
Adhesives for structural bonding in automotive and rail transportation components.
Base resin for UV-curable and hybrid (UV/thermal) dual-cure formulations.
| Chemical Type | Bisphenol A diglycidyl ether (DGEBA) |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Transparent, homogeneous liquid at 25°C |
| Epoxy Equivalent Weight (EEW) | 184–190 g/eq |
| Viscosity (25°C) | 11,000–13,000 mPa·s |
| Chlorine Content (Total) | ≤ 700 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | ≥ 12 months at < 25°C in sealed containers |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
