Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Ashland Benecel E50 Methyl Cellulose

Ashland Benecel E50 Methyl Cellulose is a premium-grade, water-soluble cellulose ether from Ashland’s Benecel™ series. Designed for thickening, suspension, and film-forming in pharmaceuticals and food, it offers excellent thermal gelation, high viscosity stability, and low ash content. Its consistent performance ensures reliable rheology control across diverse formulations.
  • ashland benecel e50 methyl cellulose_e53ac2f3
  • ashland benecel e50 methyl cellulose_e53ac2f3

Features Of Ashland Benecel E50 Methyl Cellulose

  1. Non-ionic, water-soluble polymer with excellent thermal gelation properties.

  2. Provides outstanding viscosity build and suspension stability in aqueous systems.

  3. Offers good film-forming capability and enhanced surface adhesion.

  4. Highly compatible with electrolytes, acids, and common industrial additives.

  5. Free-flowing, low-dust powder with consistent batch-to-batch performance.

Typical Applications Of Ashland Benecel E50 Methyl Cellulose

  1. Cement-based tile adhesives and grouts.

  2. Exterior insulation finishing systems (EIFS) and stucco formulations.

  3. Self-leveling underlayments and repair mortars.

  4. Water-based architectural coatings and texture finishes.

  5. Pharmaceutical tablet binders and controlled-release matrices.

Specifications Of Ashland Benecel E50 Methyl Cellulose

Chemical TypeMethyl cellulose ether
Product FormFree-flowing white to off-white powder
AppearanceFine, dry, homogeneous granular powder
Primary ApplicationsConstruction mortars, coatings, pharmaceuticals
Key FeaturesThermal gelation, water retention, rheology control
BenefitsImproved workability, extended open time, reduced sag
pH (1% aqueous solution)5.0 – 8.0
Viscosity (2% solution at 20°C)Approx. 45–55 mPa·s (Brookfield RV, spindle #3, 20 rpm)


Get in Touch with ERICW
Let competitive chemical materials go global.

Your Name *

Your Email *

Your Phone

Country

Your Message *