High purity bisphenol-F based epoxy resin with low chloride content.
Excellent thermal stability and glass transition temperature (Tg) retention after curing.
Low viscosity at room temperature, enabling easy processing and improved filler wetting.
Superior chemical resistance to acids, alkalis, and solvents in cured form.
Consistent batch-to-batch performance meeting ISO 9001 manufacturing standards.
High-performance electrical encapsulation and potting compounds.
Advanced composite matrices for aerospace and wind turbine blade laminates.
Corrosion-resistant coatings for marine and offshore infrastructure.
Structural adhesives requiring elevated temperature resistance.
UV-stable flooring systems for pharmaceutical and cleanroom environments.
| Chemical Type | Bisphenol-F epoxy resin |
| Product Form | Liquid |
| Appearance | Pale yellow, clear, transparent liquid |
| Epoxy Equivalent Weight (EEW) | 170–178 g/eq |
| Viscosity (25°C) | 12,000–16,000 cP |
| Chloride Content | ≤ 500 ppm |
| Volatiles (by weight) | ≤ 0.3% |
| Storage Stability (25°C) | ≥ 12 months in sealed container |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China