High purity bisphenol A-based epoxy with consistent molecular weight distribution.
Excellent thermal stability and glass transition temperature (Tg) suitable for demanding curing profiles.
Low chloride content (< 500 ppm), ensuring superior electrical insulation properties.
Optimized viscosity (12,000–14,000 cP at 25°C) for enhanced processability in coating and composite applications.
Reproducible reactivity with standard amine and anhydride hardeners, enabling predictable gel times and full cure development.
Electrical laminates for printed circuit boards (PCBs) requiring high dielectric strength.
Structural adhesives in aerospace and automotive bonding systems.
High-performance protective coatings for marine and industrial infrastructure.
Matrix resin for carbon fiber and fiberglass reinforced composites.
Encapsulants and potting compounds for power electronics and LED modules.
| Chemical Type | Bisphenol A diglycidyl ether (DGEBA) |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free from gels or suspended particles |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 12,000–14,000 mPa·s (cP) |
| Chloride Content | ≤ 500 ppm |
| Softening Point | 12–16°C |
| Volatiles (105°C, 2 h) | ≤ 0.3 wt% |
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E-mail: wangxingqiang@ericwchem.com
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