High reactivity with amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and treated plastics without surface priming.
Low viscosity (12,000–14,000 cP at 25 °C) enabling easy processing via casting, impregnation, and filament winding.
Superior thermal stability with glass transition temperature (Tg) exceeding 125 °C after full cure.
Low chloride content (< 200 ppm), minimizing corrosion risk in electronic and aerospace assemblies.
Aerospace composite tooling and mandrels requiring dimensional stability under thermal cycling.
High-voltage electrical encapsulation for transformers, bushings, and insulators.
Structural adhesive formulations for automotive bonding of aluminum and CFRP components.
Prepreg matrix resin for carbon fiber laminates used in wind turbine blades and sporting goods.
Castable insulation systems for medium-voltage power electronics and busbar protection.
| Chemical Type | Bisphenol-F based liquid epoxy resin |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Amber to pale yellow, transparent |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity (25 °C) | 12,000–14,000 cP |
| Chloride Content | < 200 ppm |
| Volatiles Content | < 0.3 wt% |
| Storage Stability | 12 months at < 25 °C in sealed containers |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China