High-performance, one-component, moisture-curing silicone adhesive with excellent adhesion to low-surface-energy substrates.
Offers outstanding thermal stability across a wide operating temperature range from –55 °C to +200 °C.
Low modulus formulation provides superior flexibility and stress relief for bonded assemblies subject to thermal cycling or vibration.
Excellent resistance to UV radiation, ozone, and weathering—ideal for long-term outdoor exposure.
Non-corrosive cure chemistry; acetoxy-free, eliminating risk of metal corrosion or substrate attack.
Automotive lighting assemblies—including headlamp and taillamp bonding and sealing.
Electronic enclosures and sensor housings requiring environmental protection and mechanical damping.
Architectural glazing and façade components where durable, flexible structural bonding is required.
Industrial control panels and display modules needing reliable adhesion to plastics, glass, and painted metals.
Appliance manufacturing for gasketing and bonding of heat-prone components such as cooktops and HVAC housings.
| Chemical Type | One-part, condensation-cure, acetoxy-free silicone adhesive |
| Product Form | Thixotropic paste, supplied in cartridges (310 mL) and sausage packs (600 mL) |
| Appearance | Opaque white to off-white paste |
| Primary Applications | Bonding, sealing, and potting of automotive, electronics, and industrial assemblies |
| Key Features | Flexible, non-corrosive, UV-stable, low-modulus, high-elongation |
| Shore A Hardness (7 days, 23 °C/50% RH) | 25–35 |
| Elongation at Break (ASTM D412) | ≥400% |
| Specific Gravity (25 °C) | 1.28–1.32 |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China