Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Dow XIAMETER ADH-6045 Silicone Adhesive

Dow XIAMETER ADH-6045 Silicone Adhesive is a high-performance, one-component, moisture-curing silicone adhesive designed for durable bonding of diverse substrates including metals, plastics, and elastomers. It offers excellent flexibility, thermal stability (–55°C to 200°C), and resistance to weathering and chemicals. Ideal for automotive, electronics, and industrial assembly applications requiring reliable long-term adhesion.
  • dow xiameter adh 6045 silicone adhesive_b4962acc
  • dow xiameter adh 6045 silicone adhesive_b4962acc

Features Of Dow XIAMETER ADH-6045 Silicone Adhesive

  1. High-performance, one-component, moisture-curing silicone adhesive with excellent adhesion to low-surface-energy substrates.

  2. Offers outstanding resistance to thermal cycling, UV exposure, and weathering over extended service life.

  3. Low modulus formulation provides superior flexibility and stress relief in bonded assemblies subject to vibration or thermal expansion.

  4. Non-corrosive and acetoxy-free cure chemistry—safe for sensitive metals, electronics, and optical components.

  5. Good flow and gap-filling capability with controlled tack time for reliable manual or automated dispensing.

Typical Applications Of Dow XIAMETER ADH-6045 Silicone Adhesive

  1. Automotive lighting assemblies—including headlamp and taillamp lens-to-housing bonding.

  2. Electronics encapsulation and structural bonding of sensors, displays, and housings in harsh environments.

  3. Architectural glazing and curtain wall systems requiring durable, elastic, and weather-resistant seals.

  4. Medical device assembly where biocompatibility support and low-ionic extractables are critical.

  5. Industrial appliance bonding—such as control panels, nameplates, and trim on white goods and HVAC units.

Specifications Of Dow XIAMETER ADH-6045 Silicone Adhesive

Chemical TypeOne-part, condensation-cure, alkoxy-functional silicone polymer
Product FormPaste-like, thixotropic adhesive in cartridge or bulk packaging
AppearanceOpaque, off-white to light gray paste
Primary ApplicationsStructural bonding, sealing, and gasketing of dissimilar substrates
Key FeaturesLow modulus, non-corrosive, UV-stable, flexible, good adhesion without primer
BenefitsReduces assembly stress, eliminates post-cure requirements, supports high-yield manufacturing
Cure MechanismMoisture-cured at ambient temperature; full cure typically achieved within 7 days (25°C/50% RH)
Shelf Life9 months unopened at ≤25°C in original sealed container


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