Name: Dow DOWSIL TC-5021 Thermally Conductive Compound
Brand: Guangzhou Eric Wei Chemical Co., Ltd.

Features Of Dow DOWSIL TC-5021 Thermally Conductive Compound

High thermal conductivity (1.5 W/m·K) for efficient heat dissipation in demanding electronic assemblies.
Low thermal resistance with excellent interfacial wetting, minimizing air gaps between heat-generating components and heatsinks.
Non-silicone-oil bleeding formulation ensures long-term stability and prevents contamination of sensitive optical or electrical surfaces.
Thixotropic paste consistency enables precise dispensing and resists slump during vertical assembly or reflow processes.
UL 94 V-0 rated for flame retardancy, supporting compliance in safety-critical power electronics applications.

Typical Applications Of Dow DOWSIL TC-5021 Thermally Conductive Compound

Power modules and IGBTs in electric vehicle inverters and industrial motor drives.
LED lighting systems requiring reliable thermal management under high ambient temperatures.
5G base station power amplifiers and RF front-end modules.
Onboard chargers (OBC) and DC-DC converters in automotive electrification systems.
High-power computing hardware, including GPU and CPU thermal interface solutions in data center accelerators.

Chemical Type	Silicone-based thermally conductive gap filler
Product Form	Paste (thixotropic)
Appearance	Off-white to light gray, homogeneous paste
Primary Applications	Thermal interface material (TIM) for power electronics and LED systems
Key Features	Non-bleeding, low thermal resistance, UL 94 V-0 compliant
Benefits	Improved reliability, simplified assembly, no post-cure required
Storage Stability	12 months at ≤25°C in unopened container
Operating Temperature Range	−40°C to +200°C continuous

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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China