Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Solvay DAPCO 2100 Adhesive

Solvay DAPCO 2100 Adhesive is a high-performance, two-component polyurethane adhesive from Solvay’s DAPCO series. It delivers excellent flexibility, impact resistance, and adhesion to diverse substrates including metals, plastics, and composites. Designed for demanding industrial bonding applications, it cures at room temperature with low exotherm and offers superior environmental resistance.
  • solvay dapco 2100 adhesive_79fdf4c4
  • solvay dapco 2100 adhesive_79fdf4c4

Features Of Solvay DAPCO 2100 Adhesive

  1. Two-component, room-temperature-curing polyurethane adhesive system offering excellent flexibility and impact resistance.

  2. Low viscosity formulation enables easy mixing, dispensing, and gap-filling for complex geometries.

  3. Outstanding adhesion to diverse substrates including metals, plastics, composites, and painted surfaces.

  4. Good chemical resistance to moisture, oils, and mild solvents after full cure.

  5. UL 94 HB rated for flammability compliance in non-structural electronic and industrial assemblies.

Typical Applications Of Solvay DAPCO 2100 Adhesive

  1. Automotive lighting assembly — bonding polycarbonate lenses to metal or plastic housings.

  2. Electronic enclosures — structural and sealing adhesion of housings, gaskets, and internal components.

  3. Industrial sensors and instrumentation — durable bonding under thermal cycling and vibration.

  4. Appliance manufacturing — attaching nameplates, control panels, and decorative trim with long-term aesthetic integrity.

Specifications Of Solvay DAPCO 2100 Adhesive

Chemical TypeTwo-component aliphatic polyurethane
Product FormLiquid (Part A: resin; Part B: curing agent)
Appearance (Mixed)Translucent amber liquid
Mix Ratio (by weight)100 : 10 (A:B)
Cure Schedule (typical)24 hours at 23°C for handling strength; 7 days for full properties
Shore A Hardness (7 days)65–70
Primary ApplicationsStructural bonding, gasketing, and encapsulation in mid-performance industrial environments
Key FeaturesRoom-temperature cure, low exotherm, no primer required on most substrates


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