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Two-component, addition-cure silicone adhesive offering excellent thermal stability and long-term reliability.
Low modulus formulation provides superior stress relief for dissimilar substrates and thermal cycling environments.
UL 94 V-0 rated for flame resistance, supporting safety-critical electronic encapsulation requirements.
Excellent adhesion to metals, plastics, ceramics, and coated surfaces without primers.
Low outgassing and high purity—qualified for aerospace and medical device assembly applications.
Encapsulation and bonding of power electronics modules including IGBTs and inverters.
Structural bonding in LED lighting assemblies exposed to elevated operating temperatures.
Attachment of sensors and control units in automotive under-hood environments.
Die attach and housing sealing for aerospace avionics and satellite components.
Medical device assembly requiring biocompatibility support and ISO 10993 compatibility documentation.
| Chemical Type | Platinum-catalyzed addition-cure silicone |
| Product Form | Two-component liquid (Part A: base; Part B: catalyst) |
| Appearance | Part A: translucent viscous liquid; Part B: translucent low-viscosity liquid |
| Mix Ratio by Weight | 10:1 (A:B) |
| Cure Schedule (Typical) | 2 hours at 100°C or 24 hours at 25°C |
| Shore A Hardness (Cured) | 35–45 |
| Volume Resistivity (ASTM D257) | >1 × 10¹⁵ Ω·cm |
| UL Recognition | UL 94 V-0, UL 746C, and CSA C22.2 No. 0.3 |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
