Two-component, room-temperature curing silicone adhesive system offering excellent flexibility and long-term durability.
Low modulus formulation provides superior stress relief for bonded assemblies subjected to thermal cycling or mechanical vibration.
Excellent adhesion to a wide range of substrates including metals, plastics, glass, and coated surfaces without primers.
UL 94 V-0 rated for flame resistance, supporting compliance in safety-critical electronic and lighting applications.
Non-corrosive and acetoxy-free chemistry—safe for sensitive electronic components and optical materials.
LED module encapsulation and lens bonding in outdoor lighting fixtures.
Thermal interface bonding of heat sinks and power electronics in EV inverters and onboard chargers.
Sealing and bonding of automotive sensors and camera housings exposed to harsh environmental conditions.
Assembly of medical diagnostic devices requiring biocompatibility-compliant, low-outgassing adhesives.
| Chemical Type | Two-part addition-cure silicone |
| Product Form | Kit with separate Part A (base) and Part B (catalyst) in pre-measured syringes |
| Appearance (Mixed) | Translucent, off-white paste |
| Mix Ratio (A:B by volume) | 1:1 |
| Cure Schedule (RT) | Surface tack-free in ~30 min; full cure in 24–72 h at 23°C/50% RH |
| Hardness (Shore A) | 25–35 after 7 days |
| Primary Applications | Structural bonding, sealing, and potting in electronics, automotive, and industrial equipment |
| Key Features | Low modulus, high elongation (>200%), thermal stability (-55°C to +200°C), UV resistance |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China