Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Dow DOWSIL EA-6052 Adhesive A&B Kit

Dow DOWSIL EA-6052 Adhesive A&B Kit is a two-part silicone-based structural adhesive offering rapid room-temperature cure high bond strength and excellent resistance to thermal cycling moisture and chemicals. Ideal for bonding metals plastics and composites in automotive electronics and industrial applications. Part A contains silicone polymer filler while Part B is the catalyst enabling precise 1:1 mix ratio and reliable performance.
  • dow dowsil ea 6052 adhesive a b kit_cec7eb75
  • dow dowsil ea 6052 adhesive a b kit_cec7eb75

Features Of Dow DOWSIL EA-6052 Adhesive A&B Kit

  1. Two-component, room-temperature curing silicone adhesive system offering excellent flexibility and long-term durability.

  2. Low modulus formulation provides superior stress relief for bonded assemblies subjected to thermal cycling or mechanical vibration.

  3. Excellent adhesion to a wide range of substrates including metals, plastics, glass, and coated surfaces without primers.

  4. UL 94 V-0 rated for flame resistance, supporting compliance in safety-critical electronic and lighting applications.

  5. Non-corrosive and acetoxy-free chemistry—safe for sensitive electronic components and optical materials.

Typical Applications Of Dow DOWSIL EA-6052 Adhesive A&B Kit

  1. LED module encapsulation and lens bonding in outdoor lighting fixtures.

  2. Thermal interface bonding of heat sinks and power electronics in EV inverters and onboard chargers.

  3. Sealing and bonding of automotive sensors and camera housings exposed to harsh environmental conditions.

  4. Assembly of medical diagnostic devices requiring biocompatibility-compliant, low-outgassing adhesives.

Specifications Of Dow DOWSIL EA-6052 Adhesive A&B Kit

Chemical TypeTwo-part addition-cure silicone
Product FormKit with separate Part A (base) and Part B (catalyst) in pre-measured syringes
Appearance (Mixed)Translucent, off-white paste
Mix Ratio (A:B by volume)1:1
Cure Schedule (RT)Surface tack-free in ~30 min; full cure in 24–72 h at 23°C/50% RH
Hardness (Shore A)25–35 after 7 days
Primary ApplicationsStructural bonding, sealing, and potting in electronics, automotive, and industrial equipment
Key FeaturesLow modulus, high elongation (>200%), thermal stability (-55°C to +200°C), UV resistance


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