High-performance, one-component, addition-cure silicone adhesive with excellent thermal stability.
Low modulus and high elongation for superior stress relief in dynamic or thermally cycled assemblies.
Fast room-temperature tack-free time and rapid cure upon heating (e.g., 15 min at 125°C).
Excellent adhesion to challenging substrates including plastics, metals, glass, and coated surfaces without primers.
UL 94 V-0 rated for flame retardancy and compliant with RoHS and REACH regulations.
LED lighting module bonding and encapsulation in high-brightness and automotive headlamp assemblies.
Thermal interface bonding of power electronics, inverters, and EV battery modules.
Sealing and bonding of sensors, actuators, and MEMS devices requiring long-term reliability under thermal cycling.
Structural assembly of medical device housings and diagnostic equipment requiring biocompatibility support.
| Chemical Type | Platinum-catalyzed addition-cure silicone |
| Product Form | Paste, thixotropic, syringeable |
| Appearance | Opaque white to off-white |
| Primary Applications | Bonding, sealing, and potting of electronic and optical components |
| Key Features | Low modulus, high elongation (>150%), fast tack-free time (<30 min RT) |
| Benefits | Reduced thermal stress, no by-products, excellent aging resistance |
| Cure Mechanism | Heat-activated addition cure (RT tack-free, accelerated above 80°C) |
| Regulatory Compliance | RoHS 2015/863, REACH SVHC-free, UL 94 V-0 (per ASTM D3801) |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China