Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Dow DOWSIL EA-7000 Silicone Adhesive

Dow DOWSIL EA-7000 Silicone Adhesive is a high-performance, two-part addition-cure silicone adhesive offering excellent thermal stability, low modulus elasticity, and strong adhesion to diverse substrates including metals, plastics, and ceramics—ideal for demanding electronic encapsulation and bonding applications.
  • dow dowsil ea 7000 silicone adhesive_833e69e4
  • dow dowsil ea 7000 silicone adhesive_833e69e4

Features Of Dow DOWSIL EA-7000 Silicone Adhesive

  1. High-performance, one-component, addition-cure silicone adhesive with excellent thermal stability.

  2. Low modulus and high elongation for superior stress relief in dynamic or thermally cycled assemblies.

  3. Fast room-temperature tack-free time and rapid cure upon heating (e.g., 15 min at 125°C).

  4. Excellent adhesion to challenging substrates including plastics, metals, glass, and coated surfaces without primers.

  5. UL 94 V-0 rated for flame retardancy and compliant with RoHS and REACH regulations.

Typical Applications Of Dow DOWSIL EA-7000 Silicone Adhesive

  1. LED lighting module bonding and encapsulation in high-brightness and automotive headlamp assemblies.

  2. Thermal interface bonding of power electronics, inverters, and EV battery modules.

  3. Sealing and bonding of sensors, actuators, and MEMS devices requiring long-term reliability under thermal cycling.

  4. Structural assembly of medical device housings and diagnostic equipment requiring biocompatibility support.

Specifications Of Dow DOWSIL EA-7000 Silicone Adhesive

Chemical TypePlatinum-catalyzed addition-cure silicone
Product FormPaste, thixotropic, syringeable
AppearanceOpaque white to off-white
Primary ApplicationsBonding, sealing, and potting of electronic and optical components
Key FeaturesLow modulus, high elongation (>150%), fast tack-free time (<30 min RT)
BenefitsReduced thermal stress, no by-products, excellent aging resistance
Cure MechanismHeat-activated addition cure (RT tack-free, accelerated above 80°C)
Regulatory ComplianceRoHS 2015/863, REACH SVHC-free, UL 94 V-0 (per ASTM D3801)


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