Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Dow DOWSIL EG-4131 Dielectric Gel Kit

Dow DOWSIL EG-4131 Dielectric Gel Kit is a two-part silicone-based insulating gel system engineered for high-voltage electrical encapsulation and thermal management. It offers excellent dielectric strength, low viscosity for easy dispensing, and stable performance across -40°C to 200°C. Ideal for EV battery modules, power electronics, and renewable energy systems requiring long-term reliability and flame retardancy.
  • dow dowsil eg 4131 dielectric gel kit_988070d4
  • dow dowsil eg 4131 dielectric gel kit_988070d4

Features Of Dow DOWSIL EG-4131 Dielectric Gel Kit

  1. Non-corrosive, silicone-based formulation designed for long-term stability in sensitive electronic environments.

  2. Ultra-low volatility and minimal outgassing, meeting stringent NASA ASTM E595 requirements for space-grade applications.

  3. Excellent dielectric strength (>20 kV/mm) with stable performance across wide temperature range (–50 °C to +200 °C).

  4. Thixotropic gel consistency ensures no slump or migration after application, even on vertical or inverted surfaces.

  5. Ready-to-use two-component kit with precise 1:1 mix ratio—no weighing or complex metering required.

Typical Applications Of Dow DOWSIL EG-4131 Dielectric Gel Kit

  1. High-voltage insulation and potting of power electronics modules, including IGBTs and inverters.

  2. Dielectric filling for aerospace avionics enclosures and satellite thermal management systems.

  3. Protection of high-frequency RF connectors and microwave components against moisture ingress and arcing.

  4. Gap-filling encapsulation for LED drivers and EV battery control units requiring thermal stability and electrical isolation.

Specifications Of Dow DOWSIL EG-4131 Dielectric Gel Kit

Chemical TypePlatinum-cured methylvinylsiloxane polymer system
Product FormTwo-part liquid gel (Part A + Part B), supplied in pre-measured syringe kits
AppearanceTranslucent, off-white viscous gel (both components)
Primary ApplicationsDielectric insulation, conformal gap filling, and high-reliability electronic encapsulation
Key FeaturesNon-corrosive, low-outgassing, thixotropic, no solvent, halogen-free
BenefitsEliminates voids and interfacial air gaps; enhances thermal cycling reliability and partial discharge resistance
Cure MechanismRoom-temperature addition cure (accelerated at elevated temperatures)
Shelf Life12 months at 25 °C unopened; 6 months after first opening when stored sealed at 25 °C


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