Non-corrosive, silicone-based formulation designed for long-term stability in sensitive electronic environments.
Ultra-low volatility and minimal outgassing, meeting stringent NASA ASTM E595 requirements for space-grade applications.
Excellent dielectric strength (>20 kV/mm) with stable performance across wide temperature range (–50 °C to +200 °C).
Thixotropic gel consistency ensures no slump or migration after application, even on vertical or inverted surfaces.
Ready-to-use two-component kit with precise 1:1 mix ratio—no weighing or complex metering required.
High-voltage insulation and potting of power electronics modules, including IGBTs and inverters.
Dielectric filling for aerospace avionics enclosures and satellite thermal management systems.
Protection of high-frequency RF connectors and microwave components against moisture ingress and arcing.
Gap-filling encapsulation for LED drivers and EV battery control units requiring thermal stability and electrical isolation.
| Chemical Type | Platinum-cured methylvinylsiloxane polymer system |
| Product Form | Two-part liquid gel (Part A + Part B), supplied in pre-measured syringe kits |
| Appearance | Translucent, off-white viscous gel (both components) |
| Primary Applications | Dielectric insulation, conformal gap filling, and high-reliability electronic encapsulation |
| Key Features | Non-corrosive, low-outgassing, thixotropic, no solvent, halogen-free |
| Benefits | Eliminates voids and interfacial air gaps; enhances thermal cycling reliability and partial discharge resistance |
| Cure Mechanism | Room-temperature addition cure (accelerated at elevated temperatures) |
| Shelf Life | 12 months at 25 °C unopened; 6 months after first opening when stored sealed at 25 °C |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China