Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Dow DOWSIL SC 4471 CV Thermally Conductive Compound

Dow DOWSIL SC 4471 CV is a thermally conductive, electrically insulating silicone compound designed for high-reliability thermal interface applications in power electronics and EV battery systems. It offers low thermal resistance, excellent long-term stability, and easy dispensing with controlled viscosity. The material cures at room temperature or accelerated heat cure for rapid throughput.
  • dow dowsil sc 4471 cv thermally conductive compound_dfd2c04a
  • dow dowsil sc 4471 cv thermally conductive compound_dfd2c04a

Features Of Dow DOWSIL SC 4471 CV Thermally Conductive Compound

  1. High thermal conductivity (1.5 W/m·K) for efficient heat dissipation in demanding electronic assemblies.

  2. Low modulus silicone formulation enables stress relief and accommodates coefficient of thermal expansion (CTE) mismatches.

  3. Room-temperature curing with optional heat acceleration, supporting flexible manufacturing integration.

  4. Non-corrosive and halogen-free, compliant with RoHS and REACH requirements for electronics reliability.

  5. Controlled viscosity and thixotropic behavior ensure excellent dispensing accuracy and minimal slump during processing.

Typical Applications Of Dow DOWSIL SC 4471 CV Thermally Conductive Compound

  1. Thermal interface material (TIM) between power semiconductors and heat sinks in automotive EV inverters.

  2. Die-attach and heat-spreading compound for LED modules in high-brightness lighting systems.

  3. Thermal management layer in 5G base station power amplifiers and RF modules.

  4. Conformal gap-filling compound for battery module cell-to-cold-plate interfaces in energy storage systems.

  5. Thermal bonding solution for IGBTs, MOSFETs, and SiC devices in industrial motor drives.

Specifications Of Dow DOWSIL SC 4471 CV Thermally Conductive Compound

Chemical TypePlatinum-cured addition-cure silicone elastomer
Product FormPaste (two-component, A+B)
AppearanceGray, homogeneous paste
Primary ApplicationsThermal interface material (TIM), gap filler, die-attach
Key FeaturesThermally conductive, electrically insulating, low modulus, non-slumping
BenefitsEnhanced reliability under thermal cycling, simplified automation dispensing, no outgassing
Curing MechanismRoom temperature cure (7 days) or accelerated at 80°C (30 min)
Storage Stability12 months at ≤25°C (unopened)


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