High thermal conductivity (1.5 W/m·K) for efficient heat dissipation in demanding electronic assemblies.
Low modulus silicone formulation enables stress relief and accommodates coefficient of thermal expansion (CTE) mismatches.
Room-temperature curing with optional heat acceleration, supporting flexible manufacturing integration.
Non-corrosive and halogen-free, compliant with RoHS and REACH requirements for electronics reliability.
Controlled viscosity and thixotropic behavior ensure excellent dispensing accuracy and minimal slump during processing.
Thermal interface material (TIM) between power semiconductors and heat sinks in automotive EV inverters.
Die-attach and heat-spreading compound for LED modules in high-brightness lighting systems.
Thermal management layer in 5G base station power amplifiers and RF modules.
Conformal gap-filling compound for battery module cell-to-cold-plate interfaces in energy storage systems.
Thermal bonding solution for IGBTs, MOSFETs, and SiC devices in industrial motor drives.
| Chemical Type | Platinum-cured addition-cure silicone elastomer |
| Product Form | Paste (two-component, A+B) |
| Appearance | Gray, homogeneous paste |
| Primary Applications | Thermal interface material (TIM), gap filler, die-attach |
| Key Features | Thermally conductive, electrically insulating, low modulus, non-slumping |
| Benefits | Enhanced reliability under thermal cycling, simplified automation dispensing, no outgassing |
| Curing Mechanism | Room temperature cure (7 days) or accelerated at 80°C (30 min) |
| Storage Stability | 12 months at ≤25°C (unopened) |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China