Two-component, addition-cure silicone adhesive system offering low viscosity and excellent flow control for precision dispensing.
Fast room-temperature cure with optional heat acceleration—achieves handling strength in under 30 minutes at 25°C.
Exceptional adhesion to challenging substrates including plastics (e.g., polycarbonate, PBT), metals, and glass without primers.
UL 94 V-0 rated for flame retardancy and compliant with RoHS and REACH regulatory requirements.
High thermal stability with continuous service temperature range from –55°C to +180°C.
Automotive electronic module bonding and potting, including sensors and control units.
LED lighting assembly—optical bonding of lenses, reflectors, and heat sinks.
Industrial IoT device encapsulation requiring environmental sealing and vibration damping.
Medical diagnostic equipment assembly where biocompatibility and low outgassing are critical.
Consumer electronics housing and display bonding for wearables and smart home devices.
| Chemical Type | Platinum-catalyzed addition-cure silicone |
| Product Form | Two-part kit (Part A: base; Part B: catalyst) |
| Appearance | Part A: translucent viscous liquid; Part B: translucent liquid |
| Mix Ratio by Weight | 10:1 (A:B) |
| Cure Mechanism | Room temperature or elevated temperature (e.g., 60–120°C) |
| Shelf Life (Unopened) | 12 months at ≤25°C, dry, unopened containers |
| Primary Applications | Bonding, sealing, and potting of electronic assemblies |
| Key Features | Low shrinkage, no by-products, excellent dielectric properties |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China