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High thermal conductivity (1.5 W/m·K) for efficient heat dissipation in demanding electronic assemblies.
Two-part, addition-cure silicone formulation enabling low mixing ratio (1:1 by volume) and extended working life.
Excellent adhesion to metals, ceramics, and engineered plastics without primer.
UL 94 V-0 rated for flame resistance, supporting safety compliance in power electronics.
Low modulus and high flexibility after cure to accommodate thermal cycling and mechanical stress.
Thermal bonding of IGBT modules and power semiconductor devices to heatsinks.
Die-attach and heat-spreader attachment in electric vehicle (EV) inverters and onboard chargers.
Attachment of LED packages and driver components in high-brightness lighting systems.
Thermal interface bonding in 5G base station power amplifiers and RF modules.
| Chemical Type | Two-part addition-cure silicone |
| Product Form | Paste (Part A and Part B supplied separately) |
| Appearance | Gray, homogeneous paste |
| Primary Applications | Thermally conductive structural bonding and die attach |
| Key Features | High thermal conductivity, low modulus, UL 94 V-0 rating, 1:1 mix ratio |
| Benefits | Reduces thermal resistance, mitigates delamination under thermal cycling, simplifies dispensing |
| Cure Schedule | 15–30 min at 150°C (full cure); room-temperature tack-free in 30–60 min |
| Storage Stability | 12 months at ≤25°C (unopened) |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
