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High-performance silicone adhesive with excellent adhesion to diverse substrates including metals, plastics, and glass.
Fast room-temperature cure with tack-free time under 15 minutes and full cure within 24 hours.
Outstanding resistance to thermal cycling, humidity, and UV exposure for long-term reliability.
Low modulus formulation provides superior stress relief and flexibility in bonded assemblies.
UL 94 HB rated — meets basic flammability requirements for electronic and industrial applications.
Encapsulation and bonding of LED lighting components and drivers.
Structural assembly of automotive sensors and interior trim modules.
Sealing and mounting of solar panel junction boxes and inverters.
Attachment of displays, touch panels, and HMI interfaces in industrial equipment.
Bonding of medical device housings requiring biocompatibility-compliant materials.
| Chemical Type | Acetoxy-cure silicone adhesive |
| Product Form | Thixotropic paste, single-component |
| Appearance | Off-white to light gray, uniform paste |
| Primary Applications | Structural bonding, sealing, and potting in electronics and transportation |
| Key Features | Room-temperature curing, low shrinkage, non-corrosive |
| Benefits | Reduced processing time, improved durability under environmental stress |
| Shelf Life (Unopened) | 12 months at 25°C in original sealed packaging |
| Storage Conditions | Store between 10–25°C; protect from moisture and direct sunlight |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
