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High thermal conductivity (≥1.5 W/m·K) for efficient heat dissipation in demanding electronic assemblies.
Low modulus silicone formulation provides stress relief and accommodates thermal cycling without cracking.
Electrically insulating — prevents short circuits while enabling reliable thermal management.
Room-temperature curing with optional heat acceleration for flexible manufacturing integration.
UL 94 V-0 rated for flame resistance, supporting safety-compliant designs.
Thermal interface between power electronics modules and heat sinks in EV inverters and onboard chargers.
Sealing and thermal bonding of LED drivers and high-brightness LED housings.
Encapsulation and thermal management of 5G base station RF power amplifiers.
Heat transfer bonding in industrial motor drives and renewable energy converters.
| Chemical Type | Filler-loaded addition-cure silicone |
| Product Form | Two-component paste (Part A + Part B) |
| Appearance | Gray, homogeneous paste |
| Primary Applications | Thermal interface material (TIM), structural thermal sealant |
| Key Features | Thermally conductive, electrically insulating, low modulus, flame retardant |
| Benefits | Reduces component operating temperature, extends device lifetime, simplifies assembly |
| Curing Mechanism | Pt-catalyzed hydrosilylation (addition cure) |
| Storage Stability | ≥6 months at 25°C (unopened) |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
