High thermal conductivity (1.5 W/m·K) for efficient heat dissipation in demanding electronic assemblies.
Low modulus silicone formulation provides excellent stress relief and long-term reliability under thermal cycling.
Room-temperature vulcanizing (RTV) system with rapid tack-free time and full cure within 24 hours at ambient conditions.
Excellent adhesion to diverse substrates including aluminum, copper, stainless steel, ceramics, and common PCB laminates.
UL 94 V-0 rated for flame resistance and compliant with RoHS and REACH directives.
Thermal interface bonding of power modules, IGBTs, and MOSFETs to heat sinks in electric vehicle inverters.
Die-attach and heat-spreader attachment in high-power LED lighting systems.
Encapsulation and thermal management of sensors and control units in automotive under-hood environments.
Structural thermal bonding of battery module components in energy storage systems.
| Chemical Type | Platinum-cured addition-cure silicone elastomer |
| Product Form | Two-component (Part A + Part B), paste-like consistency |
| Appearance | Off-white to light gray, homogeneous paste |
| Primary Applications | Thermal interface material (TIM), structural thermal adhesive, die-attach |
| Key Features | Thermally conductive, electrically insulating, low modulus, RTV cure |
| Benefits | Reduces interfacial thermal resistance, accommodates CTE mismatch, enables automated dispensing |
| Cure System | Addition-cure (platinum catalyst); no by-products |
| Storage Stability | 12 months at ≤25°C in unopened containers |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China