Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Dow DOWSIL SE 4450 Thermally Conductive Silicone Adhesive

Dow DOWSIL SE 4450 is a thermally conductive silicone adhesive offering excellent heat dissipation, electrical insulation, and long-term reliability for bonding heat sinks to power electronics. It cures at room temperature or accelerated with mild heat, delivers low modulus for stress relief, and maintains stability across wide temperature and humidity ranges.
  • dow dowsil se 4450 thermally conductive silicone adhesive_b12c9d80
  • dow dowsil se 4450 thermally conductive silicone adhesive_b12c9d80

Features Of Dow DOWSIL SE 4450 Thermally Conductive Silicone Adhesive

  1. High thermal conductivity (1.5 W/m·K) for efficient heat dissipation in demanding electronic assemblies.

  2. Low modulus silicone formulation provides excellent stress relief and long-term reliability under thermal cycling.

  3. Room-temperature vulcanizing (RTV) system with rapid tack-free time and full cure within 24 hours at ambient conditions.

  4. Excellent adhesion to diverse substrates including aluminum, copper, stainless steel, ceramics, and common PCB laminates.

  5. UL 94 V-0 rated for flame resistance and compliant with RoHS and REACH directives.

Typical Applications Of Dow DOWSIL SE 4450 Thermally Conductive Silicone Adhesive

  1. Thermal interface bonding of power modules, IGBTs, and MOSFETs to heat sinks in electric vehicle inverters.

  2. Die-attach and heat-spreader attachment in high-power LED lighting systems.

  3. Encapsulation and thermal management of sensors and control units in automotive under-hood environments.

  4. Structural thermal bonding of battery module components in energy storage systems.

Specifications Of Dow DOWSIL SE 4450 Thermally Conductive Silicone Adhesive

Chemical TypePlatinum-cured addition-cure silicone elastomer
Product FormTwo-component (Part A + Part B), paste-like consistency
AppearanceOff-white to light gray, homogeneous paste
Primary ApplicationsThermal interface material (TIM), structural thermal adhesive, die-attach
Key FeaturesThermally conductive, electrically insulating, low modulus, RTV cure
BenefitsReduces interfacial thermal resistance, accommodates CTE mismatch, enables automated dispensing
Cure SystemAddition-cure (platinum catalyst); no by-products
Storage Stability12 months at ≤25°C in unopened containers


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