High-performance, one-component, moisture-curing silicone adhesive with excellent adhesion to challenging substrates including plastics, metals, and painted surfaces.
Low modulus formulation provides superior flexibility and stress relief for bonded assemblies subjected to thermal cycling or vibration.
Excellent resistance to UV radiation, ozone, and extreme temperatures (–55 °C to +180 °C continuous service).
Non-corrosive, acetoxy-free cure chemistry—safe for use with sensitive electronic components and optical materials.
Good flow and gap-filling capability with controlled tack time and deep-section cure performance.
Automotive lighting assembly—including headlamp and taillamp bonding and sealing.
Electronics encapsulation and structural bonding of sensors, displays, and housings.
Architectural glazing and façade component attachment where movement accommodation is required.
Industrial equipment assembly involving dissimilar substrates and dynamic load conditions.
Appliance manufacturing for durable, weather-resistant bonding of control panels and trim components.
| Chemical Type | One-part, condensation-cure, acetoxy-free silicone adhesive |
| Product Form | Paste-like, thixotropic, cartridge-ready material |
| Appearance | Off-white to light gray, uniform paste |
| Primary Applications | Structural bonding, sealing, and gasketing in automotive, electronics, and industrial markets |
| Key Features | Low modulus, high elongation (>300%), excellent adhesion without primer on many substrates |
| Benefits | Reduced assembly stress, long-term reliability under thermal cycling, RoHS-compliant formulation |
| Cure Mechanism | Moisture-cured at ambient temperature; surface tack-free in ~15–30 minutes (23 °C/50% RH) |
| Shelf Life | 12 months unopened in original sealed packaging at ≤25 °C |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China