Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Dow DOWSIL SE 9185 Silicone Adhesive

Dow DOWSIL SE 9185 Silicone Adhesive is a one-component, moisture-curing elastomeric sealant offering excellent adhesion to glass, aluminum, and plastics without primers. It delivers high flexibility, UV resistance, and thermal stability from −40°C to +150°C. Ideal for architectural glazing and solar panel assembly due to low modulus and superior weatherability.
  • dow dowsil se 9185 silicone adhesive_778d79ba
  • dow dowsil se 9185 silicone adhesive_778d79ba

Features Of Dow DOWSIL SE 9185 Silicone Adhesive

  1. High-performance, one-component, moisture-curing silicone adhesive with excellent adhesion to challenging substrates including plastics, metals, and painted surfaces.

  2. Low modulus formulation provides superior flexibility and stress relief for bonded assemblies subjected to thermal cycling or vibration.

  3. Excellent resistance to UV radiation, ozone, and extreme temperatures (–55 °C to +180 °C continuous service).

  4. Non-corrosive, acetoxy-free cure chemistry—safe for use with sensitive electronic components and optical materials.

  5. Good flow and gap-filling capability with controlled tack time and deep-section cure performance.

Typical Applications Of Dow DOWSIL SE 9185 Silicone Adhesive

  1. Automotive lighting assembly—including headlamp and taillamp bonding and sealing.

  2. Electronics encapsulation and structural bonding of sensors, displays, and housings.

  3. Architectural glazing and façade component attachment where movement accommodation is required.

  4. Industrial equipment assembly involving dissimilar substrates and dynamic load conditions.

  5. Appliance manufacturing for durable, weather-resistant bonding of control panels and trim components.

Specifications Of Dow DOWSIL SE 9185 Silicone Adhesive

Chemical TypeOne-part, condensation-cure, acetoxy-free silicone adhesive
Product FormPaste-like, thixotropic, cartridge-ready material
AppearanceOff-white to light gray, uniform paste
Primary ApplicationsStructural bonding, sealing, and gasketing in automotive, electronics, and industrial markets
Key FeaturesLow modulus, high elongation (>300%), excellent adhesion without primer on many substrates
BenefitsReduced assembly stress, long-term reliability under thermal cycling, RoHS-compliant formulation
Cure MechanismMoisture-cured at ambient temperature; surface tack-free in ~15–30 minutes (23 °C/50% RH)
Shelf Life12 months unopened in original sealed packaging at ≤25 °C


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