Name: Dow DOWSIL TC-2035 CV Thermally Conductive Adhesive
Brand: Guangzhou Eric Wei Chemical Co., Ltd.

Features Of Dow DOWSIL TC-2035 CV Thermally Conductive Adhesive

High thermal conductivity (1.5 W/m·K) for efficient heat dissipation in demanding electronic assemblies.
Room-temperature cure with optional heat acceleration, enabling flexible manufacturing integration.
Low modulus and high elongation (>80%) to absorb thermal stresses and mitigate CTE mismatch between components.
Excellent adhesion to common substrates including aluminum, copper, FR-4, and thermoplastics without primers.
UL 94 V-0 rated flame retardancy and RoHS-compliant formulation for safety-critical applications.

Typical Applications Of Dow DOWSIL TC-2035 CV Thermally Conductive Adhesive

Thermal interface bonding of power modules and IGBTs in electric vehicle inverters.
Attachment of heat sinks to LED PCBs and driver boards in high-brightness lighting systems.
Die attach and heat spreader bonding in 5G base station RF power amplifiers.
Thermal management of battery module monitoring electronics and BMS sensors.
Structural thermal bonding in aerospace avionics enclosures requiring vibration resistance and reliability.

Chemical Type	Two-part addition-cure silicone adhesive
Product Form	Paste (Part A and Part B supplied separately)
Appearance	Gray, homogeneous paste
Primary Applications	Thermal interface material (TIM), structural thermal bonding
Key Features	Thermally conductive, electrically insulating, low stress, flame retardant
Cure Schedule (Standard)	24 hrs at 25°C or 60 mins at 80°C
Density (25°C)	Approx. 2.4 g/cm³
UL Recognition	UL 94 V-0 (per UL 746C)

Get in Touch with ERICW

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E-mail: wangxingqiang@ericwchem.com
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15921782326
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China