English
Español
tiếng việt
русский
Ultra-low modulus enables stress-free thermal interface performance under thermal cycling.
Non-silicone-oil bleeding formulation ensures long-term stability and prevents contamination of adjacent components.
Excellent conformability to irregular surfaces and low-height gaps (down to 0.1 mm).
Thermally stable across -40 °C to 150 °C operating range with minimal degradation over time.
Re-workable and non-curing — maintains tack and conformability throughout device lifetime.
High-power LED modules requiring reliable heat dissipation in automotive lighting systems.
Power electronics in electric vehicle (EV) inverters and onboard chargers.
5G base station power amplifiers and RF semiconductor packages.
AI accelerator and GPU cooling assemblies in data center servers.
Industrial motor drives and renewable energy inverters for solar/wind applications.
| Chemical Type | Silicone-based thermally conductive gel |
| Product Form | Paste (non-flowing, thixotropic) |
| Appearance | Off-white, homogeneous gel |
| Thermal Conductivity | 1.5 W/m·K (ASTM D5470) |
| Density | 2.1 g/cm³ (ISO 1183) |
| Operating Temperature Range | -40 °C to +150 °C |
| Dielectric Strength | ≥15 kV/mm (ASTM D149) |
| UL Recognition | UL 94 V-0 (flammability rating) |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
