High-purity solid bisphenol-A based epoxy resin with consistent molecular weight distribution.
Excellent thermal stability and low volatility, suitable for high-temperature processing.
Superior electrical insulation properties and low dielectric loss at elevated frequencies.
Good compatibility with common amine and anhydride curing agents for versatile formulation flexibility.
Low chloride ion content (< 500 ppm), minimizing corrosion risk in electronic encapsulation applications.
Electrical and electronic encapsulants for power modules and semiconductor devices.
High-performance structural adhesives requiring thermal and chemical resistance.
Prepregs and laminates for printed circuit board (PCB) substrates.
Composite matrices in aerospace and wind energy components.
Powder coating binders for industrial metal finishing.
| Chemical Type | Bisphenol-A diglycidyl ether (DGEBA) epoxy resin |
| Product Form | Off-white to light tan solid flakes or pellets |
| Appearance | Free-flowing crystalline solid at room temperature |
| Epoxy Equivalent Weight (EEW) | 475–495 g/eq |
| Melting Point | 100–110 °C (by DSC, onset) |
| Softening Point | 85–95 °C (Ring & Ball method) |
| Chloride Content | ≤ 500 ppm |
| Volatiles (150 °C, 2 h) | ≤ 0.3 wt% |
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E-mail: wangxingqiang@ericwchem.com
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