Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Dow EPON Olin DER 662E 1004F Solid Epoxy Resin

Dow EPON Olin DER 662E 1004F is a high-purity solid epoxy resin from Dow’s EPON™ series, offering excellent thermal stability, low melt viscosity, and superior adhesion for composites and electrical encapsulation. Widely used in aerospace, wind energy, and printed circuit boards due to its consistent reactivity and low ionic impurities.
  • dow epon olin der 662e 1004f solid epoxy resin_cea2abc5
  • dow epon olin der 662e 1004f solid epoxy resin_cea2abc5

Features Of Dow EPON Olin DER 662E 1004F Solid Epoxy Resin

  1. High-purity solid bisphenol-A based epoxy resin with consistent molecular weight distribution.

  2. Excellent thermal stability and low volatility, suitable for high-temperature processing.

  3. Superior electrical insulation properties and low dielectric loss at elevated frequencies.

  4. Good compatibility with common amine and anhydride curing agents for versatile formulation flexibility.

  5. Low chloride ion content (< 500 ppm), minimizing corrosion risk in electronic encapsulation applications.

Typical Applications Of Dow EPON Olin DER 662E 1004F Solid Epoxy Resin

  1. Electrical and electronic encapsulants for power modules and semiconductor devices.

  2. High-performance structural adhesives requiring thermal and chemical resistance.

  3. Prepregs and laminates for printed circuit board (PCB) substrates.

  4. Composite matrices in aerospace and wind energy components.

  5. Powder coating binders for industrial metal finishing.

Specifications Of Dow EPON Olin DER 662E 1004F Solid Epoxy Resin

Chemical TypeBisphenol-A diglycidyl ether (DGEBA) epoxy resin
Product FormOff-white to light tan solid flakes or pellets
AppearanceFree-flowing crystalline solid at room temperature
Epoxy Equivalent Weight (EEW)475–495 g/eq
Melting Point100–110 °C (by DSC, onset)
Softening Point85–95 °C (Ring & Ball method)
Chloride Content≤ 500 ppm
Volatiles (150 °C, 2 h)≤ 0.3 wt%


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