High reactivity with standard amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and treated plastics without primer requirement.
Low viscosity (12,000–15,000 cP at 25°C) enabling easy processing via casting, impregnation, and filament winding.
Superior electrical insulation properties with high dielectric strength (>18 kV/mm) and low dissipation factor.
Good thermal stability with glass transition temperature (Tg) of 125–135°C after post-cure.
Electrical encapsulation of transformers, reactors, and high-voltage insulators.
Structural adhesive formulation for aerospace composite bonding and repair.
Matrix resin for fiber-reinforced laminates in wind turbine blade manufacturing.
Underfill and potting compound for power electronics and EV battery modules.
Tooling and mold-making resin for RTM and compression molding applications.
| Chemical Type | Bisphenol-F based liquid epoxy resin |
| Product Form | Clear to pale amber viscous liquid |
| Appearance | Homogeneous, free from sediment or haze |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity (25°C) | 12,000–15,000 cP |
| Chloride Content | ≤ 500 ppm |
| Volatiles Content | ≤ 0.3 wt% |
| Storage Stability | 12 months at ≤ 25°C in sealed original container |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China