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High purity bisphenol-A based liquid epoxy resin with consistent molecular weight distribution.
Excellent compatibility with common amine, anhydride, and phenolic curing agents.
Low viscosity (11,000–13,000 cP at 25°C) enabling easy processing and improved filler dispersion.
Superior electrical insulation properties and low dielectric loss at elevated frequencies.
Good thermal stability with glass transition temperature (Tg) of cured system up to 125°C.
Electrical encapsulation and potting compounds for transformers, reactors, and sensors.
High-voltage insulating coatings and busbar protective layers.
Structural adhesives in aerospace and automotive composite bonding.
Base resin for filament-wound pipes and pressure vessels requiring chemical resistance.
Matrix resin in printed circuit board (PCB) prepregs and laminates.
| Chemical Type | Bisphenol-A diglycidyl ether (DGEBA) |
| Product Form | Clear, low-viscosity amber liquid |
| Appearance | Transparent to slightly yellow, homogeneous liquid |
| Epoxy Equivalent Weight (EEW) | 187–193 g/eq |
| Viscosity (25°C) | 11,000–13,000 cP |
| Chlorine Content | ≤ 800 ppm |
| Hydrolyzable Chloride | ≤ 150 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
