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High thermal stability with glass transition temperature (Tg) exceeding 170 °C after full curing.
Excellent chemical resistance to acids, alkalis, and solvents in harsh industrial environments.
Superior electrical insulation properties, ideal for high-reliability electronic encapsulation.
Low ionic impurity content, minimizing risk of electrochemical migration in microelectronic applications.
Good adhesion to copper, ceramic, and FR-4 substrates without requiring specialized primers.
Encapsulation and molding compounds for semiconductor devices (e.g., ICs, power modules).
Underfill materials for flip-chip and CSP (chip-scale package) interconnects.
Die-attach adhesives in high-power LED and automotive electronics assemblies.
Matrix resin in high-performance prepregs for aerospace-grade laminates.
Electrical potting compounds for transformers, sensors, and high-voltage connectors.
| Chemical Type | Cresol-formaldehyde novolac epoxy resin |
| Product Form | Pale yellow to amber solid pellets or flakes |
| Appearance | Free-flowing, homogeneous granules; no visible foreign particles |
| Epoxy Equivalent Weight (EEW) | 190–210 g/eq |
| Melting Point | 85–95 °C |
| Softening Point | 80–90 °C (ring-and-ball method) |
| Chlorine Content | ≤ 300 ppm |
| Volatiles Content | ≤ 0.3 wt% (at 150 °C, 2 hrs) |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
