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High purity bisphenol-A based liquid epoxy resin with consistent molecular weight distribution.
Excellent thermal stability and low ionic impurity content for reliable electrical insulation performance.
Optimized viscosity (12,000–14,000 cP at 25°C) enabling efficient processing in casting, potting, and laminating applications.
Superior adhesion to metals, glass fibers, and cured thermoset substrates without primer requirement.
Low chloride content (<300 ppm) ensuring corrosion resistance in demanding electronic and aerospace environments.
Electrical encapsulation and potting of high-voltage transformers and sensors.
Structural adhesive formulations for automotive composite bonding.
Prepreg and laminate resins for FR-4 printed circuit board (PCB) manufacturing.
Wind turbine blade matrix resin in conjunction with hardeners and fillers.
High-performance coatings for offshore and chemical plant infrastructure.
| Chemical Type | Bisphenol-A diglycidyl ether (DGEBA) |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Water-white to pale yellow, transparent |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 12,000–14,000 cP |
| Chlorine Content | ≤300 ppm |
| Color (Gardner) | ≤2 |
| Volatile Content | ≤0.3 wt% |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
