English
Español
tiếng việt
русский
High reactivity with amine and anhydride hardeners for rapid gelation and reduced cycle times.
Excellent adhesion to metals, composites, and treated plastics under ambient and elevated cure conditions.
Low viscosity (8,000–12,000 cP at 25°C) enabling easy processing, impregnation, and air release.
Superior electrical insulation properties with high dielectric strength and volume resistivity.
Good chemical resistance to weak acids, alkalis, and solvents after full cure.
Electrical encapsulation of transformers, reactors, and high-voltage insulators.
Structural adhesive formulation for aerospace composite bonding and metal-to-metal joining.
Matrix resin for filament-wound pressure vessels and fiber-reinforced polymer (FRP) tanks.
Underfill and glob-top protection for power electronics and IGBT modules.
Castings and potting compounds for industrial sensors and control system housings.
| Chemical Type | Diglycidyl ether of bisphenol-F (BPF) |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Amber to pale yellow, transparent |
| Epoxy Equivalent Weight (EEW) | 175–185 g/eq |
| Viscosity (25°C) | 9,500 ± 1,500 cP |
| Softening Point | Not applicable (liquid at room temperature) |
| Chloride Content | ≤ 500 ppm |
| Storage Stability | 12 months at 20–25°C in sealed container |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
